Popis předmětu - AE1M13VEZ
Přehled studia |
Přehled oborů |
Všechny skupiny předmětů |
Všechny předměty |
Seznam rolí |
Vysvětlivky
Návod
Výsledek studentské ankety předmětu je zde: AE1M13VEZ
| AE1M13VEZ | Manufacturing of Electronic Equipment | ||
|---|---|---|---|
| Role: | Rozsah výuky: | 2P+2L | |
| Katedra: | 13113 | Jazyk výuky: | EN |
| Garanti: | Zakončení: | Z,ZK | |
| Přednášející: | Kreditů: | 5 | |
| Cvičící: | Semestr: | Z | |
Webová stránka:
http://ocw.cvut.cz/moodle/course/enrol.php?id=260Anotace:
Mechanical and electrical design. The electric contact. Joining of conductors. Cooling of components and equipment Printed circuit boards fabrication. Soldering in electronics. Electromagnetic compatibility of electronic equipment. Protection of components and equipment, sensitive on electrostatic field. Certification, accreditation, quality control and quality assurance.Výsledek studentské ankety předmětu je zde: AE1M13VEZ
Cíle studia:
Přehled moderních způsobů výroby konkurence schopných elektronických zařízení.Osnovy přednášek:
| 1. | Mechanical and electrical design of electronics equipment | |
| 2. | Electrical contacts. Basic feature. Application. | |
| 3. | Mechanical, metallurgical and adhesive joints in electronics | |
| 4. | Influence of environmentalism on construction and materials of joints. | |
| 5. | PCBs of different types including flexible PCBs | |
| 6. | Assembly in electronics - THT | |
| 7. | Assembly in electronics - SMT | |
| 8. | Production facility for assembly electronics | |
| 9. | Temperature conditions of components and equipment. Crystal oven, cooling, heat pipe. | |
| 10. | Manufacturing, operating and working environment. | |
| 11. | Protection of components and equipment sensitive on electrostatic discharge | |
| 12. | Electromagnetic compatibility. Shielding of workplaces and equipment | |
| 13. | In-production control, control of electronic production | |
| 14. | ISO 9000, ISO 14 000, control and assurance of quality |
Osnovy cvičení:
| 1. | Safety of operation in laboratories. Instructions of tasks. | |
| 2. | Joints, jointing in electronics. | |
| 3. | Electromechanical contact systems. | |
| 4. | Measurement of contact resistance of contacts. | |
| 5. | Fabrication of solder and adhesive joints. | |
| 6. | Measurement of parameters of soldering and adhesives joints. | |
| 7. | Electrostatic discharge sensitive components (ESDS). | |
| 8. | Measurement of ionic contamination of components and PCB. | |
| 9. | Visit to factory: manufacturing of electronics equipment. | |
| 10. | Video demonstration - product equipment . | |
| 11. | Mounting and repair PCB - manufacturing samples - part 1. | |
| 12. | Mounting and repair PCB - manufacturing samples - part 2. | |
| 13. | Shielding technology - demonstration and measurement of samples. | |
| 14. | Evaluation of reports from measurements. A credit. |
Literatura:
1 Hwang, J. S. Modern Solder Technology for Competetive Electronics Manufacturing. McGraw-Hill, New York 1996. 2 Sung Jim Kim, Sang Woo Lee. Air Cooling Technology for Electronic Equipment. CRC Press, Inc. New York. 1996Požadavky:
A student has to obtain a credit before an examination.Poznámka:
| Rozsah výuky v kombinované formě studia: 14p+6l |
Klíčová slova:
Electronic equipment. PCB. Assembly of components. Soldered joints. Glued joints. Cooling.Předmět je zahrnut do těchto studijních plánů:
| Plán | Obor | Role | Dop. semestr |
| Stránka vytvořena 18.9.2024 09:51:12, semestry: Z/2024-5, Z/2023-4, Z/2025-6, L/2023-4, L/2024-5, připomínky k informační náplni zasílejte správci studijních plánů | Návrh a realizace: I. Halaška (K336), J. Novák (K336) |