Subject description - B1B13VES
Summary of Study |
Summary of Branches |
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List of Roles |
Explanatory Notes
Instructions
| B1B13VES | Manufacturing of Electrical Components | ||
|---|---|---|---|
| Roles: | PZ | Extent of teaching: | 2P+2L |
| Department: | 13113 | Language of teaching: | CS |
| Guarantors: | Papež V. | Completion: | Z,ZK |
| Lecturers: | Papež V. | Credits: | 6 |
| Tutors: | Gdula L., Hájek J., Horák M., Papež V., Pražanová A. | Semester: | L |
Anotation:
Technology of electric components in general. Basic technology in use. Type of components: resistors, potentiometers, capacitors with foil dielectric. Ceramic and electrolytic capacitors. Electromechanical devices . Semiconductors, fabrication of vertical and horizontal structures. Packaging.Study targets:
A student are well-educated of technology of electric components, properties of fundamental electronic devices and their quality testing methodsCourse outlines:
| 1. | Components used in electrical or electronics circuits. | |
| 2. | Identification of electronic components. Standards of nominal values. | |
| 3. | Resistors, Power resistors. | |
| 4. | Nonlinear resistors, potentiometers. | |
| 5. | Capacitors - roll-type, ceramic, electrolytic. | |
| 6. | Inductance devices, HF coils, chokes, transformers. | |
| 7. | Power inductance HF devices, chokes. Power filters | |
| 8. | Switches, connectors | |
| 9. | Electromechanical devices, relay, | |
| 10. | Batteries and storage cells | |
| 11. | Lines. Distributed parameter devices. | |
| 12. | Semiconductor device design, fabrication of structures. | |
| 13. | Survey of modern semiconductor devices and IO technologies. | |
| 14. | Packaging and connecting of devices. |
Exercises outline:
| 1. | Safety in laboratories. Instruction about lab. measurements - group 1. | |
| 2. | Instruction about lab. measurements - group 1. | |
| 3. | Nonlinear resistors | |
| 4. | Ferroelectric capacitors. | |
| 5. | HF coils | |
| 6. | Resistor and capacitors characteristics at HF | |
| 7. | Power pulse transformer. | |
| 8. | Instruction about lab. measurements - group 2. | |
| 9. | Relay, electric contacts. | |
| 10. | Distributed parameter lines. | |
| 11. | Active semiconductor devices. | |
| 12. | Electronic components mounting 1 | |
| 13. | Electronic components mounting 2 | |
| 14. | Evaluation of lab. reports. A credit. |
Literature:
| 1. | Horn, Delton T.: Electronic Components: A complete reference for project builders. Blue Ridge - TAB Books, 1992 |
Requirements:
The credit reguirements: seminar presentation, one protokol of labs and the student must obtain minimally 50 % of avaliable points in the tests.Keywords:
electronic components, manufacturing Subject is included into these academic programs:| Program | Branch | Role | Recommended semester |
| BPEEM_BO_2018 | Common courses | PZ | 4 |
| BPEEM1_2018 | Applied Electrical Engineering | PZ | 4 |
| Page updated 25.4.2025 17:53:37, semester: Z/2026-7, L/2025-6, Z/2024-5, L/2026-7, L/2024-5, Z/2025-6, Send comments about the content to the Administrators of the Academic Programs | Proposal and Realization: I. Halaška (K336), J. Novák (K336) |