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Explanatory Notes
Instructions
Web page:
https://moodle.fel.cvut.cz/courses/A1B13VST
Anotation:
Production systems in electrical engineering will be characterized, their arrangement and basic technologies for mechanical joints and plastic parts. Manufacturing of windings,drying and impregnation processes will also been presented. Next part of a course will be focused on basic technologies for semiconductors including power integration. Beam technologies, technologies using plasma, packaging and basic assembly technologies will also been presented.
Study targets:
Students learn basic types of technological processes used in electrical production as well as with basic types of power electronic components and their properties.
Course outlines:
| 1. | | Lasers and laser beams as a technological tool. Laser Beam Applications |
| 2. | | Electron beam as a technological tool. Electron beam sources. Plasma technologies. |
| 3. | | Thin layers. Use of thin films. |
| 4. | | Thick layers. Dielectric heating. |
| 5. | | Induction heating. Technological applications of power electric or current field. |
| 6. | | Basics of winding technology. |
| 7. | | Drying in electrical production. |
| 8. | | Impregnation technology. |
| 9. | | Technology of power wires and cables. |
| 10. | | Power diodes, PIN diodes and Schottky diodes. Structure, basic characteristics. |
| 11. | | Bipolar transistor. Structure, basic characteristics. |
| 12. | | Current controlled components. Thyristors, switchable components. |
| 13. | | Voltage-controlled components, MOSFET, IGBT transistor, structure, basic characteristics. |
| 14. | | Passive components for use in power circuits. |
Exercises outline:
| 1. | | Organization of labs, safety in the laboratory, explanation and demonstration of tasks 1 to 2 |
| 2. | | Explanation and demonstration of tasks 3 to 6 |
| 3. | | Vacuum drying and impregnation. |
| 4. | | Soft soldering in electrical engineering. |
| 5. | | Joining of power cables. |
| 6. | | Joining of conductors and cables. Test. |
| 7. | | Drilling and checking of PC boards. |
| 8. | | Sputtering and evaporation of thin films. |
| 9. | | Explanation and demonstration of tasks 7 to 9. |
| 10. | | Task 7 |
| 11. | | Task 8 |
| 12. | | Task 9 |
| 13. | | Checking of laboratory results. |
| 14. | | Assessment. |
Literature:
| 1. | | Benda, V. et al: Power Semiconductor Devices - Theory and Applications, J. Wiley, 1999 |
| 2. | | Bruce, R. G. et al.: Modern Materials and Manufacturing Processes, Prentice Hall, 2003 |
| 3. | | Pokharel, B. P., Karki, R. N.: Electrical Engineering Materials. Alpha Science, Oxford, 2007 |
| 4. | | Herman, S. L.: Electrical machines and transformers. Cengape Learning. 2012 |
| 5. | | Schaaf, P.: Laser processing of materials. Springer. 2012 |
| 6. | | Plasma processing, Hephaestus books, 2011 |
Chopra, K. L., Kaur, I.: Thin films devices applications. Plenum Press, 2011
Requirements:
A student must attend at a practical training and must obtain an assessment before examination. A knowledge of lectured matter and laboratory tasks will be required at examination.
Note:
| A student has to obtain a credit before an examination. |
Keywords:
Power electronic components, basic technological processes
Subject is included into these academic programs:
| Page updated 19.4.2024 17:54:04, semester: Z,L/2023-4, Z/2024-5, Send comments about the content to the Administrators of the Academic Programs |
Proposal and Realization: I. Halaška (K336), J. Novák (K336) |