Summary of Study |
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Explanatory Notes
Instructions
Web page:
https://moodle.fel.cvut.cz/courses/B0B13KEO
Anotation:
Printed circuit boards and modular constructions. Single sided, double sided and multi-layer boards. Through-hole and surface mount technologies. Designing printed circuits patterns. Passive and semiconductor components for electronic circuits. Manual and automated assembly. Soldering techniques. Testing of printed circuit boards during the manufacturing.
Study targets:
A student are well-educated of properties of fundamental electronic devices, theit application at realization of electronic circuits, technology of ralization of PCB and methods of actuating of electronic equipment
Course outlines:
1. | | Realization methods of electronic circuits |
2. | | Design technique of real circuits |
3. | | Printed circuits board technologies and component bonding |
4. | | Practical design of printed circuits boards |
5. | | Computer design |
6. | | Passive components - specific properties |
7. | | active components - specific properties |
8. | | Power supplies for electronic circuits, design, realization |
9. | | Component assembly. Soldering technique |
10. | | Switching and wiring components |
11. | | Putting into operation, testing |
12. | | Selection of measuring methods and apparatus |
13. | | Design effect on equipment reliability |
14. | | Basic Standards for electronic equipments |
Exercises outline:
1. | | Introduction. Safety provisions. Catalogue of components |
2. | | Methods of realization electronic circuits |
3. | | Printed circuits boards design |
4. | | Computer - aided program Kicad |
5. | | Computer - aided program Kicad |
6. | | Electronic circuits realization - scheme |
7. | | Electronic circuits realization - function verification |
8. | | Electronic circuits realization - printed circuits boards |
9. | | Component assembly |
10. | | Electronic circuits realization - soldering |
11. | | Circuits function testing |
12. | | Circuits parameters measuring |
13. | | Final report |
14. | | A credit |
Literature:
[1] | | Leonida, G., Handbook of Printed Circuit Design, Manufacture Components & Assembly. Electrochemical Publications, IOM, 2000 |
Requirements:
The credit reguirements: seminar presentation, realization of electronic circuit, protokol of circuit realization and the student must obtain minimally 50 % of avaliable points in the tests.
Keywords:
Electronic devices, PCB mounting
Subject is included into these academic programs:
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Page updated 14.10.2024 17:51:34, semester: Z/2025-6, Z,L/2024-5, L/2023-4, Send comments about the content to the Administrators of the Academic Programs |
Proposal and Realization: I. Halaška (K336), J. Novák (K336) |