Subject description - A8M34ICS
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Instructions
| A8M34ICS | IC Structures | ||
|---|---|---|---|
| Roles: | PO | Extent of teaching: | 2P+2C |
| Department: | 13134 | Language of teaching: | CS |
| Guarantors: | Jakovenko J. | Completion: | Z,ZK |
| Lecturers: | Jakovenko J., Janíček V. | Credits: | 5 |
| Tutors: | Jakovenko J., Janíček V. | Semester: | Z |
Web page:
https://moodle.fel.cvut.cz/courses/A8M34ICSAnotation:
Student learn main design methodologies of analog, digital and optoelectronic integrated systems; Detailed description of the technological process for the IC production; CMOS technologies and its advanced sub-micron trends; IC chip topology, layout and design rules; Technology of micro-electro-mechanical systems MEMS.Study targets:
Students will understand the problems of the design of integrated circuits and integrated systems.Course outlines:
| 1. | Historical overview of the development of integrated systems and integrated circuits, design methodologies, perspective trends. | |
| 2. | Methodology of analog, digital and mixed-signal integrated systems (top down, bottom up), the design abstraction levels, Application Specific Integrated Systems ASIC - principles of ASIC hierarchy, comparing the performance, economics aspects | |
| 3. | Fabrication integrated circuits processes - materials, wafer preparation, types of lithography (DUV, EUV, electron, X-Ray), etching (plasma, RIE) | |
| 4. | Fabrication integrated circuits processes - ion implantation, diffusion, epitaxial growth, chemical vapor deposition CVD, PVD, planarization, copper metallization, ICs packaging and testing. | |
| 5. | The CMOS process technology step by step, IC topology and layout, routing, CMOS technology design kits. | |
| 6. | Modern sub-micron IC technologies, Silicon on Insulator (SOI) technology, Strained silicon technology, Radio Frequency ICs, multilevel metallization (dual Damascene), fin FET technology. | |
| 7. | CAD tools for the design of integrated circuits, IC circuit simulations analysis (DC, Transient, AC, Noise, PSS, PAC), testing and diagnostics. Design methodologies of digital, analog and mixed integrated systems. | |
| 8. | Design of Analog Integrated System - technological requirements, concept of analog design and hierarchical structure (Hierarchy editor) models and libraries for analog blocks; Layout and ICs topology, design rules, parasitic structures and parasitic extraction. | |
| 9. | Digital integrated system technology requirements, specifications and abstraction methods Digital design methodologies. IC technology (Design Kit) selection, Hardware Description Language HDL, Synthesis. | |
| 10. | Digital circuit Physical Synthesis - chip topology, floorplaning, routing; design rule check, parasitic extraction. Placement of functional blocks, power distribution, clock distribution, chip verification methods. | |
| 11. | Mixed-signal design methodologies, technology requirements abd design specifications, hierarchical classification, component models for analog and digital blocks. | |
| 12. | Micro-electro-mechanical systems MEMS - technologies, applications. | |
| 13. | Testing and diagnosis of integrated systems, design for manufacturing and yield. | |
| 14. | Reserve |
Exercises outline:
| 1. | Introduction to work under UNIX and introduction to CADENCE design tools | |
| 2. | CMOS design kits, simulation of analogue ICs, simulator Spectre. | |
| 3. | Parameters of logic gates and characteristics of CMOS transmition gate. | |
| 4. | Analog IC design flow, testbenches | |
| 5. | Influence of processing variances, Corner analysis, Monte Carlo analysis. | |
| 6. | Layout of analogue IC. | |
| 7. | Layout of analogue IC. | |
| 8. | Design rule check, parasitic extraction. | |
| 9. | Digital IC design flow, simulations. | |
| 10. | Synthesis and verification of digital IC design. | |
| 11. | Design of optic devices for sensors and informatics | |
| 12. | Design of optoelectronic devices for sensors and informatics, substitute circuits. | |
| 13. | Principles of optical and optoelectronic IC design | |
| 14. | Work presentation, final assessment |
Literature:
https://moodle.fel.cvut.cz/course/view.php?id=2454Requirements:
The students are expected to have a good understanding of the electronic components principle (unipolar and bipolar transistor, etc.) and electronics circuit analysis. Students are expected to have knowledge of modelling and simulation of electronic circuits.Keywords:
Microelectronics, IC design Subject is included into these academic programs:| Program | Branch | Role | Recommended semester |
| MPOES3 | Solid State Systems | PO | 1 |
| Page updated 4.1.2026 17:52:24, semester: L/2024-5, L/2025-6, L/2026-7, Z/2025-6, Z/2026-7, Send comments about the content to the Administrators of the Academic Programs | Proposal and Realization: I. Halaška (K336), J. Novák (K336) |